VIA-HS is a high-quality hollow steel column with a precision-ground and inductively hardened surface. It forms the basis for a wide range of modular assemblies and enables flexible connection of system components.

The hollow columns are available in various diameters:
– VIA-HS12 (12 mm)
– VIA-HS20 (20 mm)
– VIA-HS30 (30 mm)
– VIA-HS40 (40 mm)
– VIA-HS50 (50 mm)
– VIA-HS60 (60 mm).

By selecting the appropriate size, customized assemblies can be flexibly realized in mounting, testing, or sensor systems. The columns are specifically designed for use with modular standard systems and ensure a precise and stable structure.